During the E3 trade show, IBM unveiled its microprocessors that will serve as the heart of the new Wii U™ system from Nintendo to be launched by 2012.
The Power-based microprocessor will pack some of IBM's most advanced technology into an energy-saving silicon package that will power Nintendo's brand new entertainment experience for consumers worldwide. IBM's unique embedded DRAM is capable of feeding the multi-core processor large chunks of data to make for a smooth entertainment experience.
Millions of chips for Nintendo featuring IBM Silicon on Insulator (SOI) technology at 45 nanometers (45 billionths of a meter) will be made at IBM’s state of art manufacturing facility in East Fishkill, N.Y.
According to IBM, the chips are built on the open, scalable Power Architecture base, IBM custom processors exploit the performance and power advantages of proven silicon-on-insulator (SOI) technology. The inherent advantages of the technology make it a superior choice for performance-driven applications that demand exceptional, power-efficient processing capability – from entertainment consoles to supercomputers.
Genyo Takeda, Senior Managing Director, Integrated Research and Development, at Nintendo Co., Ltd said "IBM has been a terrific partner for many years. We truly value IBM's commitment to support Nintendo in delivering an entirely new kind of gaming and entertainment experience for consumers around the world,"
